DayOne Data Centers is seeking a HK$1. 86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.
Source: [Bloomberg Markets](https://www.bloomberg.com/news/articles/2026-08-21/dayone-seeks-loan-to-fund-hong-kong-data-center-ahead-of-us-ipo)